Proposed Research
“Crack Problems in Bonded Inelastic and inhomogeneous Materials Subjected to Heat and Mass Diffusion”
Objective
- To develop numerical tools to solve relevant thermal diffusion/stress and related fracture mechanics problems
- To develop numerical tools to solve relevant moisture diffusion/stress and related fracture mechanics problems
- To develop numerical tools to solve relevant oxygen diffusion/stress and related fracture mechanics problems
- To apply these numerical tools to realistic problems in FGM TBCs and semiconductor packaging.