My Research can be described simply as follows

DELIMINATION & CRACKING IN I.C.'s & OXIDATION PROBLEM IN TBC's

This is a very common problem in todays IC's (even in Pcs).

These figures explain how delimination and cracking occur due to moisture diff.

This is a Top view of a deliminated Integrated Circuit I.C. Red Zones are the Deliminated Areas

This is a side view of a Deliminated and Cracked Integrated Circuit. White zone at the bottom is the deliminated zone .You can also see the crack emerging from the corner of the I.C.

This is the geometry of my dissertation problem. I use Nonlinear FEM (Finite Element Methods) and always write my own code. With the help of these Models I am trying to predict under what kind of conditions CRACKING occurs and what materials are more resistant to cracking.